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1 physical sputtering
фізичне розпилюванняEnglish-Ukrainian dictionary of microelectronics > physical sputtering
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2 sputtering
розпилювання Процес випуску атомів або групи атомів з поверхні катода (негативного електроду) у вакуумній трубці як результат дії важких іонів. Цей процес використовується для осадження тонкого шару металу на скло, пластик, метал або іншу поверхню у вакуумі - bulk sputtering
- cathode sputtering
- dc sputtering
- diode sputtering
- high-rate sputtering
- ion-beam sputtering
- laser sputtering
- magnetron sputtering
- physical sputtering
- plasma sputtering
- radio-frequency cathode sputtering
- reactive sputtering
- RF sputtering
- secondary sputtering
- thin-film sputtering
- triode sputteringEnglish-Ukrainian dictionary of microelectronics > sputtering
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3 tool
1) інструмент; пристосування; оснащення (напр. фотошаблону) 2) устаткування; верстат 3) піддавати механічній обробці 4) pl (інструментальні) засоби - antistatic tool
- artwork checking tool
- bonding tool
- CAD tools
- CAE/CAD tools
- computer-aided tool
- computer-aided engeneering tools
- computer-based design tools
- design synthesis tools
- desoldering tool
- diamond scribe tool
- DIP/IC insertion tool
- extraction tool
- hand tool
- insertion tool
- lead-forming tool
- lithography tool
- mask inspection tool
- physical layout tools
- pick-up tool
- placement tool
- process characterization tool
- scribing tool
- software tools
- soldering tool
- sputtering tool
- step-and-repeat tool
- wafer-reading tool
- wire-wrapping tool
- work tool
См. также в других словарях:
physical sputtering — fizikinis dulkinimas statusas T sritis radioelektronika atitikmenys: angl. physical sputtering vok. physikalisches Sputtern, n rus. физическое распыление, n pranc. pulvérisation physique, f … Radioelektronikos terminų žodynas
Sputtering — is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. It is commonly used for thin film deposition, etching and analytical techniques (see below). Physics of sputtering Physical… … Wikipedia
Physical vapor deposition — (PVD) is a variety of vacuum deposition and is a general term used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of the material onto various surfaces (e.g., onto semiconductor wafers). The… … Wikipedia
Sputtering — A process used to apply photovoltaic semi conductor material to a substrate by a physical vapor deposition process where high energy ions are used to bombard elemental sources of semiconductor material, which eject vapors of atoms that are then … Energy terms
High Power Impulse Magnetron Sputtering — (HIPIMS, also known as High Impact Power Magnetron Sputtering and High Power Pulsed Magnetron Sputtering, HPPMS) is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely… … Wikipedia
Electron beam physical vapor deposition — or EBPVD is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous… … Wikipedia
Ion beam — An ion beam is a type of particle beam consisting of ions. Ion beams have many uses in electronics manufacturing (principally ion implantation) and other industries. Today s ion beam sources are typically derived from the mercury vapor thrusters… … Wikipedia
Medard W. Welch Award — The award is given to scientists who demonstrated outstanding research in the fields pertinent to American Vacuum Society. It was established in 1969 in memory of Memory of Medard W. Welch, a founder of American Vacuum Society. The prestige of… … Wikipedia
Sputter cleaning — is the cleaning of a solid surface in a vacuum by using physical sputtering of the surface. Sputter cleaning is often used in vacuum deposition and ion plating. In 1955 Farnsworth, Schlier, George, and Burger reported using sputter cleaning in an … Wikipedia
Магнетронное распыление — Магнетронное распыление это технология нанесения тонких плёнок на подложку с помощью магнетрона. Основы технологии Принцип магнетронного распыления основан на образовании над поверхностью катода кольцеобразной плазмы в результате… … Википедия
fizikinis dulkinimas — statusas T sritis radioelektronika atitikmenys: angl. physical sputtering vok. physikalisches Sputtern, n rus. физическое распыление, n pranc. pulvérisation physique, f … Radioelektronikos terminų žodynas